Sr. Electronics Packaging Engineer career at Moog, Inc in Salt Lake City

Moog, Inc is in need of Sr. Electronics Packaging Engineer on Fri, 07 Sep 2012 16:48:48 GMT. The general purpose of this position is to provide highly skilled and innovative project engineering leadership for the marketing, planning, concept definition, design, development, execution, and coordination required to produce complex systems. Uses professional concepts to contribute to development of company concepts and principles and to achieve objectives in creative and effective ways...

Sr. Electronics Packaging Engineer

Location: Salt Lake City Utah

Description: Moog, Inc is in need of Sr. Electronics Packaging Engineer right now, this career will be placed in Utah. More details about this career opportunity kindly see the descriptions. The general purpose of this position is to provide highly skilled and innovative project engineering leadership for the marketing, planning, concept definition, design, development, execution, and coordination required to produce complex systems. Uses professional concepts to contribute to development of company concepts and principles and to achieve objectives in creative and effective ways.

• BS or MS degree in Mechanical Engineering
• 8+ years exp working with electronic systems in aerospace
• Comfortable with working in a Multi-disciplined Integrated Product Team (IPT)
• Unigraphics design and 3-D modeling proficiency is essential
• Must provide cabling, CCAs and Box level designs
• Previous experience packaging High Power electronics is important
• Will be involved in collaboration with the customer for the resolution of packaging issues
• Design efforts may be coming from multiple sites and coordination with other groups is required
• In depth knowledge of Manufacturing techniques is required, including brazed, hogged out, sheet metal and composite materials.
• Must be able to glean packaging related requirements from customer specifications and create designs that meet these specifications

o Environments and Impact to System Design  Thermal Extremes  Dynamic Environments and Isolation  Humidity, Icing, Rain & Salt Fog  Fluids and NBC  EMI/EMC o Reliability o Envelope and Weight o Industry Standards for Electronic Packaging o Qualification requirements such as High Vibration and Shock

• Must be familiar with Electronics Packages, Lead Geometries & Mounting

o Through Hole Technology o Surface Mount Technology o Solder Technology

• Must be an expert in the packaging of aerospace electronics hardware
• Must be able to accurately estimate design weight, determine Center of Gravity and Moment of Inertia of designs
• Ability to multi-task up to 3 unique projects is required
• The successful candidate must be a US Person and able to work on Military projects with no restrictions
• Analysis of Structural integrity, Mechanical Tolerance and Electronics Thermal Dissipation and the following tools (ANSYS, SINDA & Betasoft) is highly desired
• Exp with DO-160 Design Assurance Guidelines is a plus
• Knowledge of primary and secondary flight control systems is a plus
• Knowledge of HALT/HASS is a plus

Position is available in Salt Lake City, UT
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If you were eligible to this career, please email us your resume, with salary requirements and a resume to Moog, Inc.

If you interested on this career just click on the Apply button, you will be redirected to the official website

This career starts available on: Fri, 07 Sep 2012 16:48:48 GMT

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